Summary:
- Researchers at the University of California, Los Angeles (UCLA) have developed the world's first six-layer complementary metal-oxide-semiconductor (CMOS) chip, a significant advancement in integrated circuit technology.
- The new chip is capable of stacking multiple layers of transistors, allowing for increased processing power and energy efficiency in a smaller footprint compared to traditional two-dimensional chip designs.
- This breakthrough in 3D chip architecture could lead to the development of more powerful and compact electronic devices, such as smartphones, laptops, and data centers, with improved performance and energy efficiency.